
Document Number: 001-15029 Rev. *G Page 9 of 31
simplify read/modify/write sequences, which can be reduced to
simple byte write operations.
Because the CY7C1471BV33, and CY7C1473BV33 are
common I/O devices, do not drive data into the device when the
outputs are active. The Output Enable (OE
) can be deasserted
HIGH before presenting data to the DQs and DQP
X
inputs. Doing
so tri-states the output drivers. As a safety precaution, DQs and
DQP
X
are automatically tri-stated during the data portion of a
write cycle, regardless of the state of OE
.
Burst Write Accesses
The CY7C1471BV33, CY7C1473BV33 have an on-chip burst
counter that enables the user to supply a single address and
conduct up to four write operations without reasserting the
address inputs. ADV/LD
must be driven LOW to load the initial
address, as described in section Single Write Accesses on page
8. When ADV/LD
is driven HIGH on the subsequent clock rise,
the chip enables (CE
1
, CE
2
, and CE
3
) and WE inputs are ignored
and the burst counter is incremented. Drive the correct BW
X
inputs in each cycle of the burst write to write the correct bytes
of data.
Sleep Mode
The ZZ input pin is an asynchronous input. Asserting ZZ places
the SRAM in a power conservation “sleep” mode. Two clock
cycles are required to enter into or exit from this “sleep” mode.
While in this mode, data integrity is guaranteed. Accesses
pending when entering the “sleep” mode are not considered valid
and the completion of the operation is not guaranteed. The
device must be deselected before entering the “sleep” mode.
CE
1
, CE
2
, and CE
3
, must remain inactive for the duration of
t
ZZREC
after the ZZ input returns LOW.
Interleaved Burst Address Table
(MODE = Floating or V
DD
)
First
Address
A1:A0
Second
Address
A1:A0
Third
Address
A1:A0
Fourth
Address
A1:A0
00 01 10 11
01 00 11 10
10 11 00 01
11 10 01 00
Linear Burst Address Table
(MODE = GND)
First
Address
A1:A0
Second
Address
A1:A0
Third
Address
A1:A0
Fourth
Address
A1:A0
00 01 10 11
01 10 11 00
10 11 00 01
11 00 01 10
ZZ Mode Electrical Characteristics
Parameter Description Test Conditions Min Max Unit
I
DDZZ
Sleep mode standby current ZZ > V
DD
– 0.2 V – 120 mA
t
ZZS
Device operation to ZZ ZZ > V
DD
– 0.2 V – 2t
CYC
ns
t
ZZREC
ZZ recovery time ZZ < 0.2 V 2t
CYC
–ns
t
ZZI
ZZ active to sleep current This parameter is sampled – 2t
CYC
ns
t
RZZI
ZZ Inactive to exit sleep current This parameter is sampled 0 – ns
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