Cypress Semiconductor CY7C1473BV33 Manual de usuario descargar pdf (Pagina 21)

CY7C1471BV33

CY7C1473BV33

Document Number: 001-15029 Rev. *G Page 21 of 31

SB4

Automatic CE power-down

current – TTL inputs

= Max, device deselected,

 V

– 0.3 V or V

 0.3 V,

f = 0, inputs static

7.5 ns cycle,

133 MHz

–165mA

Electrical Characteristics (continued)

Over the Operating Range

Parameter

[15, 16]

Description Test Conditions Min Max Unit

Capacitance

Parameter

[18]

Description Test Conditions

100-pin TQFP

Package

165-ball FBGA

Package

Unit

ADDRESS

Address input capacitance T

= 25C, f = 1 MHz,

= 3.3 V, V

DDQ

= 2.5 V

6 6 pF

DATA

Data input capacitance 5 5 pF

CTRL

Control input capacitance 8 8 pF

CLK

Clock input capacitance 6 6 pF

I/O

I/O capacitance 5 5 pF

Thermal Resistance

Parameter

[18]

Description Test Conditions

100-pin TQFP

Max

165-ball FBGA

Max

Unit



Thermal resistance

(junction to ambient)

Test conditions follow standard test methods

and procedures for measuring thermal

impedance, according to EIA/JESD51.

24.63 16.3 C/W



Thermal resistance

(junction to case)

2.28 2.1 C/W

AC Test Loads and Waveforms

Figure 5. AC Test Loads and Waveforms

OUTPUT

R = 317 

R = 351 

5pF

INCLUDING

JIG AND

SCOPE

(a)

(b)

OUTPUT

= 50 

= 1.5 V

3.3 V

ALL INPUT PULSES

DDQ

GND

90%

10%

90%

10%

 1 ns

(c)

OUTPUT

R = 1667 

R = 1538 

5pF

INCLUDING

JIG AND

SCOPE

(a)

(b)

OUTPUT

= 50 

= 1.25 V

2.5 V

ALL INPUT PULSES

DDQ

GND

90%

10%

90%

10%

 1 ns

(c)

3.3 V I/O Test Load

2.5 V I/O Test Load

Note

18. Tested initially and after any design or process change that may affect these parameters.

1 2 ... 16 17 18 19 20 21 22 23 24 25 26 ... 30 31

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