
CY7C1386D, CY7C1386F
CY7C1387D, CY7C1387F
Document Number: 38-05545 Rev. *H Page 33 of 36
Acronyms Document Conventions
Units of Measure
Acronym Description
BGA ball grid array
CE
chip enable
CMOS complementary metal oxide semiconductor
FBGA fine-pitch ball grid array
I/O input/output
JTAG Joint Test Action Group
LMBU logical multiple-bit upsets
LSB least significant bit
LSBU logical single-bit upsets
MSB most significant bit
OE
output enable
SEL single event latch-up
SRAM static random access memory
TAP test access port
TCK test clock
TDI test data-in
TDO test data-out
TMS test mode select
TQFP thin quad flat pack
TTL transistor-transistor logic
Symbol Unit of Measure
°C degree Celsius
k kilo ohms
MHz Mega Hertz
µA micro Amperes
µs micro seconds
mA milli Amperes
mV milli Volts
mm milli meter
ms milli seconds
ns nano seconds
ohms
% percent
pF pico Farad
ps pico seconds
VVolts
WWatts
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