Cypress Semiconductor MoBL CY62126EV30 Manual de usuario descargar pdf (Pagina 5)

CY62126EV30 MoBL



Document #: 38-05486 Rev. *H Page 5 of 16

Capacitance

For all packages. Tested initially and after any design or process changes that may affect these parameters.

Parameter Description Test Conditions Max Unit

Input capacitance T

= 25 °C, f = 1 MHz, V

= V

CC(typ)

10 pF

OUT

Output capacitance 10 pF

Thermal Resistance

Tested initially and after any design or process changes that may affect these parameters.

Parameter Description Test Conditions

VFBGA

Package

TSOP II

Package

Unit



Thermal resistance

(Junction to ambient)

Still Air, soldered on a 4.25 × 1.125 inch,

two-layer printed circuit board

58.85 28.2 °C/W



Thermal resistance

(Junction to case)

17.01 3.4 °C/W

Figure 3. AC Test Loads and Waveforms

Parameters 2.2 V - 2.7 V 2.7 V - 3.6 V Unit

R1 16600 1103 

R2 15400 1554 

8000 645 

1.2 1.75 V

OUTPUT

30 pF

INCLUDING

JIG AND

SCOPE

GND

90%

10%

90%

10%

Rise Time = 1 V/ns

Fall Time = 1 V/ns

OUTPUT V

Equivalent to: THÉVENIN EQUIVALENT

ALL INPUT PULSES

1 2 3 4 5 6 7 8 9 10 ... 15 16

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