Cypress Semiconductor CY8C24894 Especificaciones Pagina 13

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CY8C24894
Document Number: 001-53754 Rev. *F Page 13 of 50
Absolute Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested.
Operating Temperature
Table 3. Absolute Maximum Ratings
Symbol Description Min Typ Max Units Notes
T
STG
Storage temperature –55 25 +100 C Higher storage temperatures
reduce data retention time.
Recommended storage
temperature is +25 C ± 25 C.
Time spent in storage at a
temperature greater than 65 °C
counts toward the Flash
DR
electrical specification in Table 16
on page 26.
T
BAKETEMP
Bake temperature 125 See
package
label
C
t
BAKETIME
Bake time See
package
label
72 Hours
T
A
Ambient temperature with power applied –40 +85 C
V
DD
Supply voltage on V
DD
relative to V
SS
–0.5 +6.0 V
V
IO
DC input voltage V
SS
– 0.5 V
DD
+ 0.5 V
V
IO2
DC voltage applied to tri-state V
SS
– 0.5 V
DD
+ 0.5 V
I
MIO
Maximum current into any port pin –25 +50 mA
I
MAIO
Maximum current into any port pin
configured as analog driver
–50 +50 mA
ESD Electro static discharge voltage 2000 V Human Body Model ESD.
LU Latch-up current 200 mA
Table 4. Operating Temperature
Symbol Description Min Typ Max Units Notes
T
A
Ambient temperature –40 +85 C
T
J
Junction temperature –40 +100 C The temperature rise from ambient
to junction is package specific. See
Table 28 on page 35. The user must
limit the power consumption to
comply with this requirement.
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