Cypress Semiconductor CY7C1383D Manual de usuario descargar pdf (Pagina 20)

CY7C1381D

CY7C1383D

Document #: 38-05544 Rev. *C Page 20 of 29

Thermal Resistance

[18]

Parameter Description Test Conditions

100 TQFP

Package

119 BGA

Package

165 fBGA

Package Unit

Thermal Resistance

(Junction to Ambient)

Test conditions follow standard

test methods and procedures

for measuring thermal

impedance, per EIA / JESD51.

28.66 23.8 20.7 °C/W

Thermal Resistance

(Junction to Case)

4.08 6.2 4.0 °C/W

Capacitance

[18]

Parameter Description Test Conditions

100 TQFP

Package

119 BGA

Package

165 fBGA

Package Unit

Input Capacitance T

= 25°C, f = 1 MHz,

= 3.3V.

DDQ

= 2.5V

589pF

CLK

Clock Input Capacitance 5 8 9 pF

I/O

Input/Output Capacitance 5 8 9 pF

AC Test Loads and Waveforms

OUTPUT

R = 317Ω

R = 351Ω

5pF

INCLUDING

JIG AND

SCOPE

(a) (b)

OUTPUT

= 50Ω

= 1.5V

3.3V

ALL INPUT PULSES

DDQ

GND

90%

10%

90%

10%

≤ 1ns

(c)

OUTPUT

R = 1667Ω

R =1538Ω

5pF

INCLUDING

JIG AND

SCOPE

(a) (b)

OUTPUT

= 50Ω

= 1.25V

2.5V

ALL INPUT PULSES

DDQ

GND

90%

10%

90%

10%

≤ 1ns

(c)

3.3V I/O Test Load

2.5V I/O Test Load

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