Cypress Semiconductor CY7C64013C Guía de usuario descargar pdf (Pagina 48)

CY7C63722C

CY7C63723C

CY7C63743C

FOR

FOR

Document #: 38-08022 Rev. *C Page 47 of 49

28.0 Package Diagrams (continued)

24-Lead Quarter Size Outline Q13

51-85055-B

DIE FORM

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24

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25

(1907, 3001)

(0,0)

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Die Step: 1907 x 3011 microns

Die Size: 1830.8 x 2909 microns

Die Thickness: 14 mils = 355.6 microns

Pad Size: 80 x 80 microns

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